At the IEDM 2024 conference, NVIDIA presented its vision for AI chips using silicon photonics, developed in collaboration with TSMC. This technology, aimed at enhancing data transfer in AI data centers, was demonstrated through a prototype using TSMC’s advanced manufacturing process, which combines two devices into a single chip using hybrid bonding (SoIC).
Silicon photonics promises data transmission speeds much faster than copper, crucial for the high-speed demands of AI data centers, according to Business Korea. While NVIDIA and TSMC strengthen their partnership, Samsung is intensifying efforts to develop its own silicon photonics technology, with processes named “I-CubeSo” and “I-CubeEo.” Companies like NVIDIA, Broadcom, and Marvell are reportedly exploring Samsung’s photonics solutions.
Silicon photonics uses light for communication instead of electricity, offering higher speeds and lower power consumption, making it essential for data-heavy applications like AI and data centers.
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