Samsung Electronics has successfully passed Nvidia‘s verification test for its fourth-generation high-bandwidth memory (HBM) chips, known as HBM3, although only partially, according to a Reuters report on Wednesday.
The South Korean tech giant has yet to comment on the development. While Nvidia has approved Samsung’s HBM3 chips, they will initially be utilized solely in the H20 processor, a less advanced model specifically designed for the Chinese market. This move aligns with the United States’ export sanctions, which restrict the sophistication of processors Nvidia can supply to China.
The future use of Samsung’s HBM3 chips in other Nvidia processors remains uncertain, Reuters sources indicate.
In the meantime, Samsung Electronics is still undergoing verification for its fifth-generation HBM chips, dubbed HBM3E. These advanced memory chips are already deployed in Nvidia’s latest GPUs, including the H200. Samsung’s main competitor, SK Hynix, has already cleared the verification process and commenced supplying HBM3E chips to Nvidia earlier this year.
Micron, another key player in the high-bandwidth memory market, is also vying for a spot in Nvidia’s H200 GPUs with its 12-layered HBM3E chips. The company announced earlier this year that it had achieved mass production of these advanced memory chips, potentially for prototype use.
SK Hynix has ambitious plans to begin mass production of similar chips in the third quarter of this year. The company accelerated its schedule amid intensifying competition, as revealed during a March news conference.
Market Reactions and Industry Impact
On the stock market, Samsung Electronics experienced a dip on Wednesday, opening at 82,100 won ($59.30), down 2.15 percent from the previous trading day. However, it managed a slight recovery in the afternoon, closing at 82,200 won, still 2.03 percent below the previous day’s closing price.
High-bandwidth memory (HBM) is a premium type of dynamic random-access memory (DRAM) that stacks dies vertically, enabling the processing of more data with lower energy consumption. The surging interest in artificial intelligence has significantly boosted demand for HBM, resulting in a supply shortage across the industry.
As the competition heats up, the verification and deployment of advanced memory chips like Samsung’s HBM3 and HBM3E are critical for maintaining a competitive edge in the rapidly evolving semiconductor market.
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